Chipchain tapes out its first design on 16 nm FinFET

The design went to the foundry on a multi-project wafer in November 2018.

Chipchain taped out a design on TSMC's 16 nm FinFET process on 6 November 2018, through a CyberShuttle multi-project wafer run.

A multi-project wafer shares one mask set among several designs. It lets a team see real silicon at a fraction of the cost of a dedicated mask set, which makes it the usual first step on a new process.

The tape-out followed the company's access to the 16 nm process earlier that year.

About Chipchain

Chipchain is a fabless AI chip company based in Shenzhen and a TSMC direct account. It designs application-specific AI chips, from architecture through tape-out to production.