Technology
FinFET design, from 16 nm to 6 nm.
As a TSMC direct account, we work across four FinFET nodes, from a full-mask tape-out at 16 nm to AI full-custom chip design.
Our design work
6 nm FinFET
AI full-custom design
AI full-custom chip design carried out for a top AI customer in 2024.
7 nm FinFET
Design authorisation
Authorised in 2019 to use TSMC's 7 nm FinFET design materials. Design studies from 2019 to 2020 covered standard cells, custom flip-flop design and placement.
12 nm FinFET
Design kit
Design kit obtained in July 2018.
16 nm FinFET
Taped out
Two designs taped out: 88 cores on a multi-project wafer in November 2018, and 200 cores on a full mask set in June 2019.
What the badges mean
- Taped out
- A design was released to the foundry and manufactured on this node.
- Design kit
- The foundry's design kit, held for this node.
- Design authorisation
- The foundry's authorisation to use its design materials for this node.
- AI full-custom design
- Full-custom chip design for AI on this node, carried out for a top AI customer.
- N6 and N7
- TSMC states that its N6 process has design rules fully compatible with N7 and allows direct migration of N7 designs (TSMC press release, 16 April 2019).
- Foundry and node
- Which foundry and node a project uses is agreed in that project's contract.
Patent
Chipchain holds Chinese invention patent CN111308329B.
Choosing a node for your chip?
Tell us the workload, the volume and the budget, and we will reply.