Design services
From wafer to shelf, on one plan.
After tape-out a chip still has to be built, tested, packaged and delivered. We plan those steps as one schedule and manage the suppliers behind each.
- Covers
- Wafer supply, wafer probe, assembly, final test and delivery
- Ways in
- As part of a design project, or as a production transfer
- Our model
- Fabless; specialist suppliers chosen and managed for each product
The steps
Six steps, one owner.
- 01WaferCapacity booked with the foundry and wafer starts tracked against the plan.
- 02Wafer probeEvery die tested on the wafer, so only good dies go on to assembly.
- 03AssemblyDies packaged to the footprint the product needs.
- 04Final testPackaged parts tested to the specification before they ship.
- 05QualityLots checked against agreed limits, with results kept for each lot.
- 06DeliveryStock held and shipped to the customer's schedule.
Questions about production
Can you take over production of an existing chip?
Yes. A production transfer starts with a review of the test program, the package and the suppliers already in place.
How is production organised?
Chipchain is fabless and a TSMC direct account. Wafers, test and assembly come from specialist suppliers, which we choose and manage for each product.
Need a production plan?
Tell us the part, the volume and the date you need it.