In June 2019 Chipchain taped out a design on TSMC's 16 nm FinFET process with a full mask set.

A full mask set is made for a single design. Unlike a seat on a shared multi-project wafer, it gives that design every site on the wafer.

The full-mask tape-out followed the company's first 16 nm tape-out, on a multi-project wafer in November 2018.